OverviewDespite its very small footprint, the de next-RAP8-EZBOX integrates a 13th Gen Intel® Core™ Series processor with Intel® Iris® Xe Graphics and Intel® DL Boost. The platform delivers up to 10 cores and 12 threads to accelerate neural-network and computer-vision workloads for industrial automation, robotics path planning and vision-based inspection.
Key Features- Onboard 13th Gen. Intel® Core™ Series Processor (15W TDP)
- Onboard LPDDR5x up to 16GB
- HDMI 1.4b x1
- 2.5GbE RJ45 x1, GbE RJ45 x1
- USB 3.2 Gen 2 x2
- M.2 2280 M-Key x1 (PCIe x2) for NVMe SSD
- DC 12Vin power input
- Fan-assisted or passive heatsink cooling options
Details- High compute density: 13th Gen Intel® Core™ CPU with Intel® Iris® Xe Graphics and Intel® DL Boost provides on-device acceleration for vision and AI inference.
- Integration-ready thermal design: 15W hybrid CPU and LPDDR5x memory reduce heat and power draw; available with fan-assisted or passive heatsink for sealed enclosures.
- Comprehensive I/O: Dual LAN (2.5GbE + GbE), two USB 3.2 Gen 2 ports and HDMI support cameras, sensors and peripherals; M.2 2280 M-Key supports high-speed NVMe storage.
Technical specifications- Model: de next-RAP8-EZBOX
- Processor: Onboard 13th Gen Intel® Core™ Series Processor (15W TDP)
- Cores / Threads: Up to 10 cores and 12 threads
- Graphics: Intel® Iris® Xe Graphics
- AI Acceleration: Integrated Intel® DL Boost
- Memory: Onboard LPDDR5x up to 16GB
- Storage Expansion: M.2 2280 M-Key x1 (PCIe x2), supports NVMe SSD
- Video Output: HDMI 1.4b x1
- Networking: 2.5GbE RJ45 x1, GbE RJ45 x1
- USB: USB 3.2 Gen 2 x2
- Power Input: DC 12Vin
- Cooling Options: Fan-assisted and passive heatsink options
- Form Factor: Ultra-compact embedded system suitable for sealed enclosure integration
- Awards: Taiwan Excellence