Pre-alignment module WAM200/300 VAC

The Adenso WAM200/300 VAC WaferAlignment.Module aligns substrates such as round and angular wafers, transparent substrates and carriers, centrally and in an angular position. The WAM is perfectly combinable with the Adenso WHR WaferHandling.Robot – the robot receives the correction data from the WaferAlignment.Module automatically via an interface. Your advantages Footprint: space-saving thanks to direct integration in cluster systems Flexible: different substrate sizes and geometries are possible Productive: fast alignment Precise: via Adenso DDU direct drive unit Cost-cutting: saves investment and operating costs