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Cylindrical grinding wheel 12A2M-304
diamond

cylindrical grinding wheel
cylindrical grinding wheel
cylindrical grinding wheel
cylindrical grinding wheel
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Characteristics

Type
cylindrical
Abrasive
diamond
Diameter

304 mm
(11.97 in)

Description

In the processing of sapphire substrate,sapphire thickness needs to be reduced, which requires high precision grinding, our products are well developed for this application. Features Smooth and high precision grinding rapidly builds up our reputation on the market, and nowadays they are used widely on nearly all famous sapphire processing factories in China. Typical Applications Widely used on grinding machines like the Galaxy, Speedfam, NTS.etc.
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.