This is a composite material of Silver and Diamond, the thermal conductivity is 600W/(m・K) and higher than Cu-Diamond.
It is applicable to large size purpose as 50×50mm.
Applications - Wireless communication, Ceramics package, Power transistor substrate, MPU, etc.
The thermal conductivity is 600W/(m・K) and higher than Cu-Diamond.
It is applicable to large size purpose as 50×50mm.