ID blades are used to slice silicon ingots and other semiconductive materials with a high degree of accuracy. ID blades have been developed to accommodate increasingly larger wafer sizes and are also used to slice glass, ceramics, and other hard materials.
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.