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Surface treatment wheel peripheraldiamond
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Characteristics
- Function
- surface treatment
- Type
- peripheral
- Abrasive
- diamond
Description
Metal bond diamond wheels are used for edge grinding of silicon wafers. For notch grinding of large-diameter wafers, a small-diameter formed wheel is employed.
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.
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