Relay expansion module xP4
I/O8 relay outputsdigital input

Relay expansion module - xP4 - ASCON TECNOLOGIC - I/O / 8 relay outputs / digital input
Relay expansion module - xP4 - ASCON TECNOLOGIC - I/O / 8 relay outputs / digital input
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Characteristics

Options
I/O, relay, 8 relay outputs, digital input
Other characteristics
analog, industrial, Ethernet

Description

Description
Remote expansion module xP4 for the sigmaPAC family. Designed to expand the I/O resources of nP4 and AC3nP controllers by adding configurable analogue and digital inputs, relay and analogue outputs, and isolated RS-485 / Ethernet communication.

Inputs
  • High-level analogue inputs (configurable): 0…5 V, 0…10 V, 0/4…20 mA (0/4 channels)
  • Analogue temperature inputs: PT1000, NTC 103-AT2 (0/8 channels)
  • Digital inputs: 4/8 — potential-free contacts or 12…48 Vac/Vdc


Outputs
  • Analogue outputs: 0/2 — 0…10 V
  • Relay outputs: 6 × 2 A SPST-NO and 2 × 8 A SPDT (total 8 relay outputs, configuration dependent)


Technical specifications
  • Model: xP4 (remote expansion module)
  • Function: Expansion module for sigmaPAC controllers (compatible with nP4, AC3nP)
  • Form factor: 6 DIN modules — 105 x 110 mm
  • Power supply: 24 Vdc
  • Number of outputs: 8 (relay or voltage)
  • Digital inputs: up to 8
  • Analogue inputs: up to 8 universal (including high-level and temperature inputs)
  • Analogue outputs: 2 channels (0…10 V)
  • Communication: Isolated RS-485; Ethernet available


Applications
Expansion of I/O in industrial automation and process control: distributed I/O for machine control, monitoring, temperature acquisition, actuator command and retrofit of existing sigmaPAC installations.

Programming & Certifications
  • Supported programming languages: IL, ST, FBD, LD, SFC, CFC
  • Certifications: CE, UL
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.