The DIVISIO 2100 is a semi-automatic depaneling machine for low-stress separation of printed circuit boards. Ideal for smaller quantities, it offers a cost-efficient alternative to the inline machine – precise, gentle and economical.
Technology
Depaneling using a router or saw
Parallelization of loading/unloading and cutting process thanks to rotary table
Linear motors for maximum dynamics and accuracy
High flexibility thanks to the use of magnetic adapters
Simplex User Interface: clear user guidance and user-friendliness
Extended Automation
Integration of AOI for cutting edge control
Bad mark detection
Automatic tool change with 8-station magazine
Interface for robot loading and unloading
Data Intelligence
Developed for SynapticaOS
ASYCAM: Offline CNC programming
100% traceability for PCBs
Sustainability
Use of the same spindle type and vacuum cleaner across all DIVISIO depaneling systems (low spare parts inventory)
Energy savings through demand-based control of the spindle and vacuum cleaner
ASYS develops modular, scalable machine solutions that can be flexibly adapted to product and process requirements, thereby conserving resources. The use of recyclable materials and a sustainable supply chain are an integral part of the development process. Intelligent energy management systems and predictive maintenance, for example, reduce the carbon footprint and ensure efficient, future-proof production.