Hybrid connector 115U-B210
datamicro SD cardSocket

Hybrid connector - 115U-B210 - ATTEND Technology Inc. - data / micro SD card / Socket
Hybrid connector - 115U-B210 - ATTEND Technology Inc. - data / micro SD card / Socket
Hybrid connector - 115U-B210 - ATTEND Technology Inc. - data / micro SD card / Socket - image - 2
Hybrid connector - 115U-B210 - ATTEND Technology Inc. - data / micro SD card / Socket - image - 3
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Characteristics

Type
data, hybrid
Format
Socket, nano SIM, micro SD card
Shape
straight, rectangular, flat
Connection type
push-pull
Electrical characteristics
low-power, AC/DC, multipole, current, voltage, shielded, insulated, switching
Material
plastic, metal, copper alloy
Product applications
for automotive applications, for industrial applications, for security camera
Domain
for industrial applications, for automotive applications
Protection class
IP67
Norms
RoHS
Other characteristics
waterproof, rugged, ultra-rugged, insulated, corrosion-resistant, heat-resistant
Primary current

0.5 A

Voltage

10 V

Operating temperature

Max.: 105 °C
(221 °F)

Min.: -40 °C
(-40 °F)

Description

Micro SD and Nano SIM Socket, Stack Type, Tray Push-Pull, w/Lock and Switch, 10u", C7025, Reel ATTEND’s 115U Push-Pull SIM Socket Series integrates a secure Push-Pull mechanism with an innovative tray design, ensuring reliable SIM retention, smooth ejection, and resistance to vibration and shock. Tested to EN 60721-3-5 Class 5M3 standards, it is optimized for automotive, industrial, and IoT applications, offering reverse insertion protection, precise card alignment, and long-term durability. For enhanced environmental resilience, the series provides IP67 waterproof protection when used with designated trays and operates within a temperature range of -40°C to +105°C. The 115U-B210 model features a 2-in-1 stacked design for SIM and Micro SD, maximizing PCB space efficiency and design flexibility. - Push-Pull Mechanism – Prevents accidental ejection due to vibrations or movement, ensuring secure card retention. (Tray is separate.) - Next-Gen Tray – Features card detection, anti-reverse insertion protection, and a tray lock function for enhanced shock resistance. - Innovative Design – Maximizes space utilization for enhanced efficiency. - Flexible PCB Layout – Optimized for both in-board and panel-side designs. - EN 60721-3-5 Certified – Withstands random vibration and Level II shock. - IP67 Waterproof – Achieves IP67 protection with designated trays. - Wide Temperature Range – Operates from -40°C to +105°C. Application: - Industrial Automation - Automotive & Transportation - Security & Surveillance - Drones - Unmanned Transport equipment - IIoT Devices - Portable Consumer Electronics - Wearable Technology - Medical Devices - Home Automation ELECTRICAL - Current Rating: 0.5A per pin - Voltage Rating: 10V DC - Contact Resistance: 100mΩ Max. - Insulation Resistance: 1000MΩ - Dielectric Withstanding Voltage: 500VAC MECHANICAL - Durability: 100 cycles - Contact Normal Force: 0.5N Max. per pin - Tray Lock Force: 3N Min. ENVIRONMENTAL - Operating temperature range: -40°C~+105°C - Storage temperature range: -40°C~+105°C SOLDER ABILITY - Recommended IR Reflow Temperature: 260°C - Micro SD and Nano SIM Socket, Stack Type, Tray Push-Pull, w/Lock and Switch, 10u", C7025, Reel - Push-Pull Mechanism for secure retention and smooth ejection - EN 60721-3-5 Class 5M3 certified for vibration and shock resistance - Reverse insertion protection and precise card alignment - IP67 waterproof with designated trays - Operating temperature: -40°C to +105°C - 2-in-1 stacked design for SIM and Micro SD - Current rating: 0.5A per pin - Voltage rating: 10V DC - Contact resistance: 100mΩ Max. - Insulation resistance: 1000MΩ - Dielectric withstanding voltage: 500VAC - Durability: 100 cycles - Contact normal force: 0.5N Max. per pin - Tray lock force: 3N Min. - Recommended IR reflow temperature: 260°C

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