Automatic assembly machine MAS 399 pro

electronic components

MAS339 Pro adopts high-strength steel frame and customized precision-grade marble structural parts, to ensure the accuracy and stability of the machine. Contact us for more details. Wafer 20Feeding 8”/12” Wafer Flange Platform Feeding Platform Multi-type of Feeding Platform Drive Linear Motor Driver Bulk Feeding Bulk-pack materials can be fully automatic identification and Pick & Place with the aid of automatic bulk material feeding platform (with vibration driver) and the advanced image recognition systems. Camera MAS399 Pro is equipped with multiple sets of HD cameras, which are used for the high-definition recognition of the die & chips, the FOV range is 0.15 * 0.15mm to 8*8 mm Pressure Bonding force (standard range) : 30g-500g (optional up to 2000g) Tray 20Feeding Tray feeding platform: Allowed 16 pcs. of 2” Gel-Pak / JEDEC material tray place on each group of Tray feeding, and max. three groups are available install in a machine. Laser Laser height-measurement device : Correspond to different components height on carrier. Effective 20Area Effective area of placement platform : 600mm x 500mm (resolution: 0.01µm) Effective area of wafer feeding platform : 220mm x 220mm (resolution: 0.01µm) Production Production capacity : 2000 dies/h (for standard application & material) Placement accuracy : ±10~20µm @ 3 sigma* (process depending)