Bonding system AT530

Bonding system - AT530 - AUTOTRONIK-SMT GmbH
Bonding system - AT530 - AUTOTRONIK-SMT GmbH
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Description

The model AT530 was specially designed for high speed bonding of IR filter in camera modules widely used in mobile phone industry. Contact us for more details. 3 Gel Dispensing Heads High speed production at 5000 pcs per hour achieved by 3 simutaneous Gel Dispensing Heads. Auto-loading System Auto-loading system for the wafer flange load and unload from magazine, maximum up to 25 storeys are supported. Highly Accurate and Stable X and Y placement accuracy less than /-15um, R accuracy as /-0.2 degree. Real-time Gel-trail Inspection Real-time Gel-trail Inspection to ensure any failed dispense shall be rejected to reduce filter wastage. • High productivity up to 5000+ pcs per hour • 3 Simultaneous Gel Dispense Heads • X/Y Repeatability Accuracy +/- 0.015mm • R-Axis Accuracy +/- 0.2° • Real-time Bond Post Checking (BPC) • High Reliability for continuous production • Real-time Gel-trail Inspection • User Friendly Software Control • *We reserve the right to make changes without notice.

Catalogs

AT530
AT530
1 Pages
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.