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Placement accuracy: 5 µm
... Panasonic's MD-P200 is a high-productivity die bonder. The synchronous head system offers unparalleled productivity, providing results that surpass conventional die bonders. The wafer ...
Panasonic Factory Automation Company
... the next generation. TDK is proud to introduce its new high-reliable, space-saving, low price equipment: AFM-15 Flip Chip Bonder (Ultrasonic Bonding Process). Low-energy bonding enables bonding with 30% to 50% less energy consumption ...
Placement accuracy: 0.5 µm - 0.8 µm
... High-Resolution Vision Systems Ensures precise alignment and inspection, crucial for maintaining high quality standards. Thin Die Capability Expertly handles thin dies, expanding your application possibilities. Superior Process ...
BE Semiconductor Industries N.V.
Placement accuracy: 3 µm - 3 µm
... mixed-device runs while maximizing uptime.
Finetech
Placement accuracy: 0.3 µm
... Automated Prototype2Production Bonder The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications ...
Finetech
Placement accuracy: 2 µm
... Automatic Multi-Purpose Bonder The automated FINEPLACER® femto pro embodies the essence of the successful FINEPLACER® femto die bonder platform, offering high precision and versatility with a focus ...
Finetech
Placement accuracy: 1.5 µm - 3 µm
... LQ-VADB30P is a high-precision multi-chip bonding machine optimized from its predecessor, offering high placement accuracy, process flexibility and throughput suitable for both high-volume and high-precision chip mounting applications.
Key features
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Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 3 µm
... Overview
HS-DB3000 is a high-speed, multi-functional mounting system engineered for high-volume industrial production. It supports modular customization, intelligent calibration and integrated data management to ensure process traceability and ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 0 µm - 12.5 µm
... LQ-DA1201 is a high-speed, high-precision die bonder for IC packaging designed for solid-state mounting processes. The machine supports silver paste placement and the DAF process, accepts LF and substrate feed, and its ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
... specialized configuration of the 6500 Die Bonder for wafer scale packaging eutectic die bonding is also available. Wafer Scale Packaging (WSP) Wafer Scale Packaging (WSP) eutectic die ...
PALOMAR TECHNOLOGIES
... The iStack™ S+ is designed for high-end epoxy and film die attach applications with process flexibility to support both the memory and image applications. Its enhanced process features include the face-down process, In-Situ UV and bond ...
Kulicke & Soffa
... The latest IGBT Power Diebonder of AUTOTRONIK is introduced. Its advantages are these multiple types and specifications of materials are compatible with one high-precision mounting equipment at the same time. ...
... The “LAPLACE-VC” laser bonder is a system suited for the vertical attachment of chips or similar devices loaded into the machine in waffle packs to various carrier substrates loaded manually onto the machine’s work stage. The system ...
Pac Tech – Packaging Technologies GmbH
... Budget sensitive Manual Die Bonder The T-4909-AE is Tresky's 40-year anniversary model. On basis of the T-4909 we developed a new software running on an integrated Raspberry PC. Like all Tresky Die Bonder ...
Dr. Tresky AG
InduBond ® 230N is a new generation of the inductive bonding machines by Chemplate for layer to layer pin registration and bonding the stack-up of inner layers and prepregs of a multilayer printed circuit. This process allows to laminate the multilayer ...
InduBond®
The EVG501 is a highly flexible wafer bonding system that can handle substrate sizes from single chips to 150 mm (200 mm in case of a 200 mm bond chamber). This tool supports all common wafer bonding processes such as anodic, glass frit, solder, eutectic, ...
EV Group
... The machines of fi conTEC‘s 300 series are small footprint yet high precision die bonders. They are designed to break down complex assembly processes into standardized recurring sub-processes for low cost of ownership. Same ...
ficonTEC Service GmbH
... Assembly Applications: PLATFORM FOR DIE ASSEMBLY AND SMALL SMD PLACEMENT Lab and Prototype (Lab, Jewelry, Watches, smd, BGA,..) Small parts handling capability Solder paste SMD Reflow Eutectic die bonding High ...
... Fully-Automatic Mounting Machine AC100 AC100 is a piece of high-stability and high-precision mounting equipment which is developed based on the precision assembly process requirements of modules and shell-and-tube devices (shells, parts and components, ...
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