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Placement accuracy: 1 µm
... li>
Key Features
- High‑precision
ASM Assembly Systems
... Product overview
ASMPT AD838L-G2 Automatic
Die
Bonder for precision
die placement and bonding in semiconductor and advanced packaging production. The system supports flip chip handling and extra-large ...
ASM Assembly Systems
Placement accuracy: 2 µm
... Overview
Flexible, precision multi-chip
die
bonder designed for large-substrate handling and 12″ wafer input, intended for automated assembly of multi-chip packages with tight placement and bond-line requirements.
Key ...
ASM Assembly Systems
Placement accuracy: 3 µm
... >
Applications
- Suitable for optical transceivers and sensor packages such as TOSA, ROSA, Mechanical Optical Interface (MOI), 3D sensors and inertial sensors
Features
- Patented
ASM Assembly Systems
Placement accuracy: 3 µm - 3 µm
... mixed-device runs while maximizing uptime.
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Placement accuracy: 0.3 µm
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Placement accuracy: 2 µm
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Placement accuracy: 0.5 µm
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