- Production Machines
- Machine for the electronics industry
- Eutectic die bonder
- ASM Assembly Systems
Eutectic die bonder NOVA Profor die-attachflip-chipepoxy
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Characteristics
- Technology
- flip-chip, epoxy, for die-attach, eutectic, multi-chip, thermal, chip-on-submount
- Operational mode
- automated
- Applications
- for the semiconductor industry, for micro assembly, for wafers, for sensors, MEMS
- Other characteristics
- high-accuracy, configurable, large-area
- Placement accuracy
1 µm
Description
Product Overview ASMPT AMICRA's NOVA Pro is a die bonding system for high‑accuracy die attach and flip‑chip assembly. It delivers placement accuracy to ±1.0 µm @ 3σ while supporting bonding temperatures above 350°C and high bonding forces. The system integrates dynamic alignment and laser‑based substrate heating and supports thermocompression bonding (TCB) and TSV‑related workflows.
Applications / Markets
Key Features
Autoloading
Optional
Technical specifications
Applications / Markets
- Optoelectronics
- Silicon photonics
- VCSEL and laser diode die bonding
- Photodiode die bonding
- Lens attach with UV‑curable adhesives
- Active Optical Cable (AOC) assemblies
- Transceiver packages
- Flip chip
- 3D IC / 2.5D IC
- Thermocompression bonding (TCB)
- Through‑Silicon Via (TSV) processes
- Chip on Chip, Chip on Wafer, Chip on Substrate
- Multi‑Chip Module (MCM)
- Advanced packaging epoxy die attach
- Eutectic in‑situ die attach
- MEMS and sensor die attach
- WLP / eWLP
Key Features
- High‑precision die bonder / flip chip bonder
- Placement accuracy: ±1.0 µm @ 3σ
- Bonding capability at temperatures > 350°C with high bonding forces
- Cycle time < 3 sec
- Modular machine concept for micro‑assembly applications
- Eutectic bonding via diode‑laser, heating plate, or epoxy stamping and dispensing
- Multi flip‑chip bonding capability
- Wafer mapping
- Post‑bond inspection and measurement
- Active bond‑force control
- Dynamic alignment method and laser‑based substrate heating
Autoloading
- Up to 12" wafers
- 300 mm wafers
- 450 mm substrate wafers
Optional
- UV curing
- Dispensing
- Additional modules available
Technical specifications
- Placement accuracy: ±1.0 µm @ 3σ
- Substrate working area: 550 x 600 mm
- Cycle time: < 3 sec
- Active bond‑force control
- Eutectic bonding methods: diode‑laser, heating plate, epoxy stamping and dispensing
- Support for thermocompression bonding (TCB) and TSV processes
- Multi flip‑chip bonding
- Wafer mapping capability
- Post‑bond inspection / measurement
- Dynamic alignment and laser‑based substrate heating technology
- Capable of bonding at temperatures exceeding 350°C
- *All performance depends on package and material
Catalogs
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.