SMT pick-and-place machine NUCLEUS

automatic

Overview
The NUCLEUS is a multi-purpose precision pick & place tool designed for 2.5D, fan-out and embedded packaging processes. It supports face-up and face-down operation with both local and global alignment for high-accuracy component placement.

Applications

• Fan-out wafer-level packaging (FOWLP) and embedded die integration
• Flip-chip and direct die-attach processes, including flux dipping
• Handling of bare wafer substrates, wafer-on-carrier and substrate-on-carrier workflows
• High-bond-force and thermal bonding applications

Key features

• Precise local and global alignment capable of sub-micron placement accuracy
• Face-up and face-down operation modes to support varied assembly flows
• Direct handling of bare dies and wafers, compatible with carriers
• Automatic tool changing system enabling multi-chip bonding and fast format changeover
• Support for high bond forces and integrated thermal process control
• Flux-dipping option for direct die attach and flip-chip bonding
• Class 100 cleaning standard during bonding to meet contamination-sensitive processes

Other configurations catering to the market

• NUCLEUS XD: extra-large die handling capability up to 70 mm × 70 mm
• NUCLEUS XLplus: extra-large substrate handling capability up to 600 mm × 670 mm

Technical specifications

• Multi-purpose precision pick & place for 2.5D, fan-out and embedded applications
• Operation: face up and face down
• Alignment: local and global alignment systems
• Process support: flip-chip, direct die attach (including flux dipping), high bond force and thermal bonding
• Handling: bare wafer substrate, wafer on carrier, substrate on carrier
• Automation: automatic tool changer for multi-chip bonding
• Cleanliness: Class 100 standard during bonding
• Optional large-format configurations: NUCLEUS XD (≤ 70 mm × 70 mm die), NUCLEUS XLplus (≤ 600 mm × 670 mm substrate)