Die bonder for the semiconductor industry LITHOBOLT® G2

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Overview
The ASMPT LITHOBOLT® G2 is a hybrid bonder engineered for Die‑to‑Wafer (D2W) hybrid bonding in advanced semiconductor packaging. It is designed to support 3D and 2.5D integration workflows with options for standalone or cascade configurations.

Key features

• Ultra‑high precision alignment and motion control tailored for hybrid bonding processes
• Direct and collective Die‑to‑Wafer (D2W) hybrid bonding capability
• Optimized interconnect formation to support high yield and throughput
• Modular design enabling standalone units or cascaded lines for higher productivity

Applications

• Hybrid bonder for advanced semiconductor packaging lines
• Die‑to‑Wafer (D2W) bonding for 3D and 2.5D integration and heterogeneous integration

Technical specifications

• Brand: ASMPT
• Commercial name (model): LITHOBOLT® G2
• Product type: Hybrid bonder
• Process: Direct and collective Die‑to‑Wafer (D2W) hybrid bonding
• Key capabilities: Ultra‑high precision control; superior interconnect formation; designed for high productivity
• Design options: Standalone or cascade configurations
• Target markets / applications: Semiconductor manufacturing, advanced packaging, 3D/2.5D and heterogeneous integration