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Placement accuracy: 5 µm
... MD-P200 is a high-productivity die bonder. The synchronous head system offers unparalleled productivity, providing results that surpass conventional die bonders. The ...
Panasonic Factory Automation Company
Placement accuracy: 0.5 µm - 0.8 µm
... upgrade to 1 kN, accommodating a variety of bonding needs. High-Resolution Vision Systems Ensures precise alignment and inspection, crucial for maintaining high quality standards. Thin Die Capability Expertly ...
BE Semiconductor Industries N.V.
Placement accuracy: 1.5 µm - 3 µm
... LQ-VADB30P is a high-precision multi-chip bonding machine optimized from its predecessor, offering high placement accuracy, process flexibility and throughput suitable for both high-volume ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 0 µm - 12.5 µm
... LQ-DA1201 is a high-speed, high-precision die bonder for IC packaging designed for solid-state mounting processes. The machine supports silver paste placement and the DAF process, accepts ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 5 µm - 5 µm
... The LQ-FC200US is a hot-press ultrasonic flip-chip mounting system designed for high-throughput, high-precision solid-state mounting and multi-process bonding. It features an operator-friendly large ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 3 µm - 3 µm
... P3 is a next-generation 12-inch die-bonding production platform that integrates ultrasonic, adhesive and eutectic bonding methods to deliver stable yields, consistent quality and accelerated throughput for high-mix, high-volume ...
Finetech
... The Palomar 6500 high precision component placement Die Bonder is designed for high-speed, fully automated precision component assembly and offers extraordinary ...
... The iStack™ S+ is designed for high-end epoxy and film die attach applications with process flexibility to support both the memory and image applications. Its enhanced process features include the face-down process, In-Situ ...
Kulicke & Soffa
... the vacuum pick and place unit of the bonder. Due to the high flexibility of the laser thermode, the system requires only a thin layer of solder on the substrate. Highlights • In-Line capability • High ...
... allows repeatability and reliability obtaining high registration precision between the inner layers (Tooling template accuracy <10 microns). The multilayer stack, previously mounted on a tooling template ...
InduBond®
... Fully-Automatic Mounting Machine AC100 AC100 is a piece of high-stability and high-precision mounting equipment which is developed based on the precision assembly process requirements of modules and ...
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