Eutectic die bonder FiNEXT P3

ultrasonicepoxyautomated

Overview
The FiNEXT P3 is a next-generation 12-inch die-bonding production platform that integrates ultrasonic, adhesive and eutectic bonding methods to deliver stable yields, consistent quality and accelerated throughput for high-mix, high-volume manufacturing. It supports seamless scaling from pilot lines to full production and is engineered for advanced packaging and semiconductor assembly workflows.

Key benefits

• Consolidates multiple bonding tools and processes into a single, high-mix capable system.
• Maintains stable yields and consistent production quality across shifts and batches.
• Reduces changeover time and increases throughput for mixed-device production.

Bonding technologies & process flexibility

• Supports ultrasonic bonding, adhesive bonding and eutectic bonding within one platform.
• Multi-process capability minimizes transfers between systems and reduces handling risk.
• Modular architecture enables switching between bonding methods and packaging styles.

Throughput, automation & handling

• 12-inch wafer ready: supports large wafers and continuous mixed-device runs while maximizing uptime.
• Automated wafer loading and delicate die management free operators for higher-value tasks.
• Delicate die handling protects sensitive components such as MEMS, photonics and laser diodes.

Precision & process control

• Placement accuracy: 3 µm placement accuracy to reduce errors, boost yield and cut rework.
• Tight alignment tolerances and process stability suitable for advanced packaging and photonic integration.
• Designed to minimize variation from inter-tool transfers and improve repeatability from pilot to production.

Applications

• Optical transceivers and photonic components
• microLED assembly and displays
• LiDAR and radar modules
• MEMS and sensor assemblies
• Power devices (SiC, GaN)
• Heterogeneous and high-density packaging

Software & factory integration

• Production software to configure workflows, track production and optimize output.
• Built for shop-floor integration with production tracking and simplified process configuration.

Development & availability

• Positioned as a next-generation production platform with beta prototypes and tracked development milestones.
• Designed to enable manufacturers to consolidate diverse advanced packaging processes and scale complex microsystem assembly to volume.

Technical specifications

• Model name: FiNEXT P3
• Wafer capability: 12-inch wafer processing ready
• Supported bonding methods: ultrasonic, adhesive, eutectic
• Placement accuracy: 3 µm
• Automation: automated wafer loading and delicate die handling
• Target applications: optical transceivers, microLED, LiDAR, radar, MEMS, power devices (SiC/GaN), photonics, heterogeneous packages
• Primary goals: stable yields, consistent quality, scalable high-mix volume production
• Platform features: modular multi-process capability, production workflow software, process tracking and optimization