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Placement accuracy: 1 µm
... Through‑Silicon Via (TSV) processes
ASM Assembly Systems
Placement accuracy: 0 µm - 1.5 µm
... Overview
ASMPT AMICRA CoS is a purpose-built
multi-
die
bonder for
Chip-on-Submount applications. It performs high-precision
multi-
die placement ...
ASM Assembly Systems
Placement accuracy: 2 µm
... Overview
Flexible, precision
multi-
chip
die
bonder designed for large-substrate handling and 12″ wafer input, intended for automated assembly of
multi-
chip ...
ASM Assembly Systems
Placement accuracy: 3 µm
... high-precision die bonder equipped with patented look-through pattern recognition technology for accurate die placement. It supports large substrates up to 200 mm × 215 mm and integrates OCR for material ...
ASM Assembly Systems
Placement accuracy: 7 µm
... Changer •Fully automatic cycle for multi- chip production •Up to 7 pick & place tools (optionally 14), 5 eject tools •Stamping tools and calibration tools possible • Die attach, flip chip ...
BE Semiconductor Industries N.V.
Placement accuracy: 10 µm
... The all new Datacon 2200 evo hF is the ultimate multi- chip Die Bonder solution for high bonding force applications. Flexibility The Datacon 2200 evo hF is the most versatile machine ...
BE Semiconductor Industries N.V.
Placement accuracy: 7 µm
... Bad mark search •Pre-defined fiducial geometry & customized teaching • Die Attach and Multi- Chip in one machine • Die pick from: wafer, waffle pack, Gel-Pak®, feeder • Die ...
BE Semiconductor Industries N.V.
Placement accuracy: 3 µm
... Max. 14 different pick up tools / nozzles •5 eject tools •3 different epoxies / adhesive in a single pass •Any flip chip / face up die combination •Dual module for even higher productivity (option) •0.05 - 25N ...
BE Semiconductor Industries N.V.
Placement accuracy: 5, 3 µm
... advanced bonder raises a field proven platform concept to an advanced level. It is the perfect fit for chip attach of any WL-FOP process, supporting both face-down (flip mode) and face-up (non flip mode) package designs. Key ...
BE Semiconductor Industries N.V.
Placement accuracy: 1.5 µm - 3 µm
... LQ-VADB30P is a high-precision multi- chip bonding machine optimized from its predecessor, offering high placement accuracy, process flexibility and throughput suitable for both high-volume and high-precision chip ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 3 µm
... production.
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 7 µm - 10 µm
... Overview
LQ-DB10 is a fully automatic
multi-
chip placement system with integrated loading and unloading, engineered for high-precision, high-stability production in semiconductor packaging, Mini LED and related ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 3 µm - 7 µm
... H3-DB20HF is a fully automatic pre-sintering placement equipment designed for R&D testing and mass production of SiC modules. The machine features a modular design with standard flow lines that can be connected in series and can be customized to specific ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 3 µm - 7 µm
... Mounting method: front/rear reference placement
Features ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 3 µm - 7 µm
... b>Technical features
- Eutectic soldering with scraping and multi-step temperature control
- Epoxy dispensing pump for silver-adhesive placement and multi-chip dispensing
- Automatic
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 2 µm
... Automatic Multi-Purpose Bonder The automated FINEPLACER® femto pro embodies the essence of the successful FINEPLACER® femto die bonder platform, offering high precision and versatility ...
Finetech
Placement accuracy: 3 µm
... Large-Area Multi- Chip Production Die Bonder The all new FineXT 6003 is a fully automatic large area production die bonder with true multi- chip, ...
Finetech
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