Multi-chip die bonder H3-DB20HF

fully-automaticfor the semiconductor industryfor wafers

H3-DB20HF is a fully automatic pre-sintering placement equipment designed for R&D testing and mass production of SiC modules. The machine features a modular design with standard flow lines that can be connected in series and can be customized to specific production needs.

Primary functions

• Preheating
• Pre-pressurization (Preload)
• Nozzle heating
• High-pressure placement

Design highlights

• Modular design enabling connection of standard flow lines in series
• Suitable for both R&D testing and mass production of SiC modules
• Supports multichip handling with flexible pickup tool switching

Application areas

• Photonics
• Power devices
• Microwave RF device field
• New energy vehicle sector

Technical parameters (summary)

• Front/back reference mount — mounting method
• Hot press mounting — mounting process includes silver film printing and silver film transferring
• Application scenarios — SiC modules

Characteristics / Technical specifications

• Mounting accuracy: ±3 μm (standard sheet); ±7 μm (application dependent)
• Equipment efficiency: UPH ≈ 1000 (application dependent)
• Multichip capability: up to 5 different pickup tools; fixed movement with flexible switching
• Alloy heating: electrically heated, thermostatically controlled, maximum heating temperature 250°C
• Feedstock compatibility: 2" GEL-PAK, 12" wafer frame
• Bonding accuracy: ±5 μm @ 3σ placement accuracy; ±0.1° @ 3σ placement rotation accuracy