Die-attach die bonder H3-DB10A

multi-chipautomatedfully-automatic

H3-DB10A is a high-precision automatic silver-adhesive placement system developed for advanced packaging processes, intended for COB R&D verification and mass production. The unit features a modular architecture and supports automatic dispensing, automatic nozzle replacement and automatic loading/unloading; system configurations are customizable to application requirements.

Key advantages

• High placement and bonding accuracy
• High throughput (application-dependent)
• Reliable automated operation

Applications

• Photonics
• Power devices
• Microwave/RF components
• New energy vehicle electronics

Technical process and capabilities

• Mounting method: front/rear reference placement
• Mounting process: silver-adhesive placement (dipping, dispensing, multi‑chip)
• Application scenarios: COB; BOX deep-cavity packages

Features / Technical specifications

• Model: H3-DB10A
• Placement accuracy: ±3 μm (standard substrate); ±7 μm (depending on application)
• Equipment throughput: UPH ≈ 800 (application-dependent)
• Bonding accuracy: ±7.5 μm @ 3σ placement accuracy; ±0.036° @ 3σ rotation accuracy
• Multi‑chip capability: up to 12 different pickup tools (fixed motion, flexible switching)
• Dispensing: pneumatic pulse dispensing with automatic tip calibration
• Feedstock compatibility: 2" GEL-PAK, 6" wafer ring
• Design: modular; supports automatic dispensing, automatic nozzle change and automatic loading/unloading; customizable solutions