Die-attach die bonder LQ-DA1201

automatedfor the semiconductor industryfor wafers

LQ-DA1201 is a high-speed, high-precision die bonder for IC packaging designed for solid-state mounting processes. The machine supports silver paste placement and the DAF process, accepts LF and substrate feed, and its die feed supports 12" wafer frames and wafer rings. Maximum placement accuracy meets ±12.5µm and throughput reaches up to 12,000 UPH.

Key features

• Compatibility with LF and substrate feed; die feed supports 12" wafer frame & wafer ring
• Silver paste placement (silver glue patch)
• High speed — UPH up to 12,000

Application areas

• Photonics
• Power devices
• Microwave RF device field
• New energy vehicle sector

Process & Technology

• Mounting method: feature-side-up, high-precision placement
• Mounting process: silver paste placement and DAF
• Product applications: IC device SMD package

Advantages / Notable capabilities

• Servo recoil technology — ±12.5µm (precision mode); ±25µm (standard mode)
• Large-area multiplexed vision system — angular accuracy ±1°
• Human–machine interface for operator control
• Dispense gel: automatic position calibration and glue recognition
• Feedstock support: 6", 8", 12" wafer rings & GEL-PAK
• Mounting accuracy: Precision mode — 5µm @3σ placement; ±0.5° @3σ rotation. Standard mode — 15µm @3σ placement; ±1° @3σ rotation

Technical specifications

• Model: LQ-DA1201
• Placement accuracy (stated): meets ±12.5µm; precision mode: 5µm @3σ
• Mounting rotation accuracy: ±0.5° @3σ (precision), ±1° @3σ (standard)
• UPH (throughput): up to 12,000
• Die feed support: 12" wafer frame & wafer ring
• Supported processes: silver paste placement, DAF
• Mounting method: feature-side-up