Automated die bonder H3-IDB10

high-accuracyconfigurable

The H3-IDB10 is an automatic multi-component surface mount system engineered for mass production of IGBT modules and similar power-device applications. It supports multi-chip and hybrid-chip placement compatible with Gel-PAK and blue-film loading methods, enables automatic product transfer between parallel workstations, and can be customized for specific production workflows.

Key capabilities

• Multi-chip and hybrid-chip placement
• Automation for production-line integration with automatic product transfer
• Parallel workstation operation to increase throughput (application dependent)

Application area

• Photonics
• Power devices
• Microwave RF devices
• New energy vehicle sector

Technical parameters (summary)

• Mounting method: front/back datum mounting (option: contour datum mounting)
• Mounting process: IGBT chip and hybrid chip mounting
• Typical application: IGBT modules

Advantages / Merits

• Configurable placement accuracy and flexible application settings
• Equipment throughput optimized for mass production (application dependent)
• Multi-chip handling: up to 12 different pickup tools and flexible tool switching for multi-head operations
• High-precision vision system with re-inspection function for process stability
• Feedstock compatibility: Gel-PAK and wafer-ring handling (e.g., 2 in Gel-PAK, 6 in wafer ring)
• Bonding accuracy and rotation control for precise placement

Specifications / Technical data

• Model: H3-IDB10
• Intended use: mass production of IGBT modules and related power-device industries
• Placement process: multi-chip and hybrid-chip mounting; compatible with Gel-PAK and blue-film loading
• Mounting method: front/back datum mounting (contour datum optional)
• Feedstock: 2 in Gel-PAK, 6 in wafer ring
• Multichip capability: up to 12 different pickup tools
• Vision: high-precision vision system with re-inspection function
• Bonding accuracy: ±15μm @ 3σ placement accuracy; ±0.5° @ 3σ placement rotation accuracy
• Mounting accuracy: ±5μm (standard sheet); ±15μm (application dependent)
• Equipment throughput: [2] S/PCS (application-dependent)
• Production line features: automatic product transfer, parallel workstations
• Customization: model can be customized according to specific application solutions