Multi-chip die bonder LQ-VADB30P

automatedfor micro assemblyfor the semiconductor industry

LQ-VADB30P is a high-precision multi-chip bonding machine optimized from its predecessor, offering high placement accuracy, process flexibility and throughput suitable for both high-volume and high-precision chip mounting applications.

Key features

• Up to five pick-and-place tools for multi-chip handling.
• Autofocus optical calibration system to enhance vision alignment.
• 360° angular calibration for accurate rotational placement.
• Simultaneous support for dipping and dispensing; up to five adhesive dipping tools available.
• Flexible process switching to accommodate dispensing and dipping workflows.
• Supports multiple feeding formats including 2” GEL-PAK and 6” wafer ring.

Performance modes

• High-precision mode: placement accuracy ±1.5 µm (standard chip placement) with productivity up to 600 UPH.
• Non-precision mode: placement accuracy approximately ±3 µm (product-dependent) with productivity up to 1,200 UPH.

Application areas

• Photonics
• Power devices
• Microwave RF devices
• New energy vehicle sector

Technical specifications

• Laminating pressure: 30 g – 250 g (programmable force control).
• Supported chip size: from 250 µm × 250 µm to 2.0 mm × 2.0 mm.
• Supported chip thickness: 0.1 mm – 1.0 mm.
• Mounting accuracy: high-precision mode ±1.5 µm @ 3σ; rotational placement accuracy ±0.1° @ 3σ.
• Multichip pickup: up to 5 different pickup tools with fixed movement and flexible switching.
• Adhesive handling: supports up to 5 different dipping needles/tools and dispensing processes.
• Feeding formats: 2” GEL-PAK and 6” wafer ring.
• Productivity: up to 600 UPH (high-precision mode) and up to 1,200 UPH (non-precision mode, product-dependent).