{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
Placement accuracy: 7 µm
... 14), 5 eject tools •Stamping tools and calibration tools possible • Die attach, flip chip and multi-chip in one machine • Die pick from: wafer, waffle pack, Gel-Pak®, feeder • Die place to: substrate, ...
BE Semiconductor Industries N.V.
Placement accuracy: 1 µm - 5 µm
... Overview
HP-EB1000FC is a fully automatic, high-precision
eutectic placement system that supports both
eutectic and silver-adhesive placement processes. It is designed for COC and COS
eutectic ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 0 µm - 12.5 µm
... HS-EB6000 is a fully automatic inline eutectic die bonder designed for high-precision soldering processes and mass production of high-power LEDs and power devices. The system delivers oxygen-free bonding ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 1 µm - 3 µm
... The eutectic surface mounter HP-EB3300 is an automated eutectic mounting system designed for precise front/back reference placement and eutectic bonding processes (dipping, dispensing). It targets demanding ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 3 µm - 3 µm
... Overview
The FiNEXT P3 is a next-generation 12-inch
die-bonding production platform that integrates ultrasonic, adhesive and
eutectic bonding methods to deliver stable yields, consistent quality and accelerated ...
Finetech
... specialized configuration of the 6500 Die Bonder for wafer scale packaging eutectic die bonding is also available. Wafer Scale Packaging (WSP) Wafer Scale Packaging (WSP) eutectic ...
PALOMAR TECHNOLOGIES
... Budget sensitive Manual Die Bonder The T-4909-AE is Tresky's 40-year anniversary model. On basis of the T-4909 we developed a new software running on an integrated Raspberry PC. Like all Tresky Die Bonder ...
Dr. Tresky AG
... case of a 200 mm bond chamber). This tool supports all common wafer bonding processes such as anodic, glass frit, solder, eutectic, transient liquid phase, and direct. The easy access bond chamber and tooling design allows for quick and ...
the best suppliers