Eutectic die bonder Datacon 2200 evo plus

multi-chip for flip chipfor die-attachepoxy

The Datacon 2200 evo plus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher bonding accuracy and lower cost-of-ownership. Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with long-term stability using a new camera system and thermal compensation algorithm, higher speed through a new image processing unit, and improved cleanroom capabilities. PLUS accuracy PLUS productivity PLUS flexibility Multi-chip capability Flexibility for customizing Open platform architecture Integrated Dispenser Pressure/time (Musashi®), Auger, Jetter types available Epoxy stamping option Filled and unfilled epoxy, wide viscosity range Small footprint, low cost-of-ownership New high-speed image processing unit Full alignment & bad mark search Pre-defined fiducial geometry & customized teaching Automatic Wafer and Tool Changer Fully automatic cycle for multi-chip production Up to 7 pick & place tools (optionally 14), 5 eject tools Stamping tools and calibration tools possible Die attach, flip chip and multi-chip in one machine Die pick from: wafer, waffle pack, Gel-Pak®, feeder Die place to: substrate, boat, carrier, PCB, leadframe, wafer Hot and cold processes supported: epoxy, soldering, thermo-compression, eutectic