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PCB plating lines
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{{/each}}
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Six sizes of plating machines are available for plating process, enable both touch-up repairs and bath plating in Pyrex beakers untill 2 liters capacity each. All units have connection ...

Professsional equipment for laboratory prototyping of through-hole plated PCBs up to 210 x 300 mm size. Clean system including built-in rinsing compartment. Maintenance free and made for easy processing and handling. ...
Bungard-Elektronik GmbH & Co. KG

Professsional equipment for laboratory prototyping of through-hole plated PCBs. Due to a second galvanic tank and increased tank dimensions, the Compacta 40 can plate 2 separate PCBs of max. 300 x 400 ...
Bungard-Elektronik GmbH & Co. KG

DETAILS With the electroless copper process the PCB normally passes through a total of five process steps to obtain the desired coating thickness of 0.5 µm and more. Depending on the individual process an accelerator ...
SCHMID

DETAILS Direct metallization techniques are used to form a conducting layer in drilled holes before copper plating, as a substitute for electroless copper processes. SCHMID Equipment is available for all commercially ...
SCHMID

... Levelling process. An extremely finely textured tin layer with a thickness between 0.7 μm and 1 μm is applied to the circuit board surface and into the bore holes. The tin layer protects untreated copper from oxidation; ...
SCHMID
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