PCB plating line

electroless tin

Immersion Tin is the lead-free alternative to the Hot Air Levelling process. An extremely finely textured tin layer with a thickness between 0.7 μm and 1 μm is applied to the circuit board surface and into the bore holes. The tin layer protects untreated copper from oxidation; it is a perfect foundation for soldering applications, as well as for plug contacts. Highly homogenous surface structure ensures a constant solderability of the circuit board Reduction of chemical deposits and cleaning costs by minimizing oxygen enrichment Heat exchanger (optional) for energy recovery from rinse water Reduction of surface turbulence and foam formation owing to immersion bath with integrated leveling tank