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PCB plating line
electroless tin

PCB plating line
PCB plating line
PCB plating line
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for PCB, electroless tin

Description

Immersion Tin is the lead-free alternative to the Hot Air Levelling process. An extremely finely textured tin layer with a thickness between 0.7 μm and 1 μm is applied to the circuit board surface and into the bore holes. The tin layer protects untreated copper from oxidation; it is a perfect foundation for soldering applications, as well as for plug contacts. Highly homogenous surface structure ensures a constant solderability of the circuit board Reduction of chemical deposits and cleaning costs by minimizing oxygen enrichment Heat exchanger (optional) for energy recovery from rinse water Reduction of surface turbulence and foam formation owing to immersion bath with integrated leveling tank

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Exhibitions

Meet this supplier at the following exhibition(s):

Intersolar 2024
Intersolar 2024

18-21 Jun 2024 Munich (Germany) Hall Vide - Stand A2.238

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    *Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.