Ultrasonic cleaning machine

automaticprocessdegreasing

Oxide replacement processes, such as Circubond, Multibond, Alpha-Prep, MEC-Etch-Bond etc., promote adhesion of copper and resin during the multilayer lamination process and eliminate the “pink ring” phenomenon. The standard process comprises cleaning, degreasing, conditioning and micro-structuring of the copper surface. Fully automatic dosing controlled by area or density calculation Batch dosing system for process chemicals Multiple cascade rinsing with flood nozzles to remove chemical residues Safe transport of very thin inner layer down to 0.025 mm material thickness