Coating thickness measuring system

weight3Dautomatic

Coating Thickness Measurement and Quality Control The panel measuring table offers a quick determination of the etching distribution after differential etching processes or the plating build-up of copper surfaces. The measurements are carried out fully automatically by a resistive sensor after entering the input parameters. Subsequently, the measuring points are evaluated by a PC and converted into a 3D diagram, statistics tool included. Precise and repeatable: fully automated measurement avoids manual handling and operation error Fast: 100 measuring points in 3.5 min Flexible: accommodates variable panel formats Quality control of etching and plating processes Process drifts are easy to spot and to correct Reduction of yield loss by early detection Dimensions: 1200 x 1120 x 1210 mm (L x W x H) Weight: 200 kg Maximum panel size: 650 x 650 mm Measuring range: copper thicknesses 1 µm – 120 µm Measuring tolerances: 0.1 µm – 10 µm Cu layer 0.1 µm – 5 µm: ± 0.075 µm Cu layer 5 µm – 10 µm: ± < 1,5 % 5 µm – 120 µm Cu layer 5 µm – 50 µm: ± 0.5 µm Cu layer 50 µm – 80 µm: ± < 1 % Cu layer 80 µm – 120 µm: ± < 2 %