Plating lines

Meco is the industry leader in leadframe solder plating and flux cleaning solutions. With over 400 installations of our computer-controlled EDF/EPL systems, we set the standard in the industry. Now, we are taking flux ...

... Advanced Cut-strip Plating System (ACP): Meco's solution for accurate silverspot plating where mechanical masking becomes impossible! - New model available for wider and longer leadframes! Meco's Solution ...

... speed selective silverspot plating in today's market. Meco originally developed the patented spot tool system to plate leadframes on a continuous basis. This lead to a number of advantages over the traditional ...

... standard for leadframe solder plating. The system is fully customized to your specific needs and is a green solution, with low power consumption and minimal chemical usage. The Meco Electro DeFlash and Electro Plating ...

... techniques like control depth plating, stripe plating, spot plating, front & rear side plating or contour plating. Finally the solder finish area of ...

... frontside metallization. Key Features - Vertical product handling - Low drag-out of plating chemicals - Compact machine design/easy to maintain - Inline plating process/high up ...

The Meco Panel Plating Line (PPL) electroplates a sub-micron layer of Copper, Indium and Gallium onto a glass substrate to form the absorber layers of a CIGS thin film solar cell. Electrochemical deposition ...

... film solar cell, Meco offers Reel-to-Reel (R2R) plating equipment. Details Based on our reel-to-reel continuous selective plating technology, Meco designs and builds custom-made ...

... reputation in the semiconductor world for leadframe plating applications. Key Features - Vertical product handling - Low drag-out of plating chemicals - Compact machine design/easy to maintain - ...

Meco Flex Antenna Plating System (FAP): a unique cost-effective additive process for RFID antenna manufacturing, Flexible PCB and Copper Clad Laminate (CCL). Low Cost RFID Antenna Production Antenna inlays for RFID ...

With the electroless copper process the PCB normally passes through a total of five process steps to obtain the desired coating thickness of 0.5 µm and more. Depending on the individual process an accelerator level can be integrated if ...

Direct metallization techniques are used to form a conducting layer in drilled holes before copper plating, as a substitute for electroless copper processes. SCHMID Equipment is available for all commercially available ...

Immersion Tin is the lead-free alternative to the Hot Air Levelling process. An extremely finely textured tin layer with a thickness between 0.7 μm and 1 μm is applied to the circuit board surface and into the bore holes. The tin layer ...

The fully automatic plating line is improved on the basis of the traditional plating line. It realizes the centralized PLC or microcomputer program control in the whole ...

Six sizes of plating machines are available for plating process, enable both touch-up repairs and bath plating in Pyrex beakers untill 2 liters capacity each. All units have connection ...

... multilayer super hard coatings. Danko Vacuum Technology is professional China DLC hard film vacuum plating machine Manufacturers and DLC hard film vacuum plating machine Company ,including but not ...

Jewelry Decoration PVD Vacuum Plating Machine PRODUCT DESCRIPTION System Summary Arc Discharge: An electric arc or arc discharge is an electrical breakdown of a gas that produces an ongoing electrical discharge. ...