epoxy die bonder / for die-attach / automated / multi-chip for flip chip
Datacon 2200 evo advanced

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epoxy die bonder / for die-attach / automated / multi-chip for flip chip epoxy die bonder / for die-attach / automated / multi-chip for flip chip - Datacon 2200 evo advanced
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Characteristics

  • Options:

    epoxy, for die-attach, automated, multi-chip for flip chip

Description

Accuracy & Flexibility for your mass production
The new Datacon 2200 evo advanced is the latest edition in the well- established and field proven Multi Module Attach platform of Besi.With an all new gantry & controller system as well as a completely new vision and camera generation Datacon 2200 evo advanced offers superb 3μm placement accuracy while still focusing on your productivity and throughput requirements.

While significantly increasing the accuracy and placement capabilities the Datacon 2200 evo advanced does not forget its roots in the Multi Module Attach family. It is still offering the unbeaten flexibility as well as the full customization capability that the Datacon 2200 evo platform is so well known for.

Key Features

Accuracy
- ± 3µm @ 3s placement accuracy
- ± 0.07° @ 3s rotational accuracy
- New vision, optics and camera system
- Various configurable (FOV & resolution) set of cameras
- 3D & contactless height measurement options

Multi-chip
- Max. 14 different pick up tools / nozzles
- 5 eject tools
- 3 different epoxies / adhesive in a single pass
- Any flip chip / face up die combination
- Dual module for even higher productivity (option)

Bonding
- 0.05 - 25N closed loop bond-force
- 0-360° bond rotation
- Heated bond head (max. 450°C) (option)
- UV curing with up to 2,000mW/cm2 (365 / 405nm) (option)

Dispensing
- High-end auger pump
- Time pressure dispensing
- Piezo jetter valves
- Pin transfer
- Auto epoxy volume control

Specifications

Die Placement Accuracy
X/Y placement accuracy:
±3 µm @ 3s
Theta placement accuracy:
± 0.07° @ 3s


Bond Head options
Temperature:
450°C
Curing:
UV curing (365 & 405nm)