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Placement accuracy: 10 µm
... the ultimate multi-chip Die Bonder solution for high bonding force applications. Flexibility The Datacon 2200 evo hF is the most versatile machine for applications like Power Modules, IGBT, MCM and SiP. It is highly ...
Placement accuracy: 3 µm - 3 µm
... mixed-device runs while maximizing uptime.
Placement accuracy: 1.5 µm - 3 µm
... LQ-VADB30P is a high-precision multi-chip bonding machine optimized from its predecessor, offering high placement accuracy, process flexibility and throughput suitable for both high-volume and high-precision chip mounting applications.
Key features
- Up
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 5 µm - 5 µm
The LQ-FC200US is a hot-press ultrasonic flip-chip mounting system designed for high-throughput, high-precision solid-state mounting and multi-process bonding. It features an operator-friendly large color touch panel with dialog-style software and supports ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 7 µm - 10 µm
... applications. The system supports mixed processing of multiple wafer types and complex components, with modular hardware and
configurable process parameters for tailored production.
Key features
- Single-head, triple-wafer-ring
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 5 µm
... chip and hybrid chip mounting
Advantages / Merits
- Configurable placement accuracy and flexible application settings
- Equipment throughput optimized for mass
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 3 µm - 7 µm
... H3-DB20HF is a fully automatic pre-sintering placement equipment designed for R&D testing and mass production of SiC modules. The machine features a modular design with standard flow lines that can be connected in series and can be customized to specific ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 3 µm - 7 µm
... H3-DB10A is a high-precision automatic silver-adhesive placement system developed for advanced packaging processes, intended for COB R&D verification and mass production. The unit features a modular architecture and supports automatic dispensing, automatic ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 1 µm - 5 µm
... Overview
HP-EB1000FC is a fully automatic, high-precision eutectic placement system that supports both eutectic and silver-adhesive placement processes. It is designed for COC and COS eutectic workflows and features an automatic tool change ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 0 µm - 12.5 µm
... HS-EB6000 is a fully automatic inline eutectic die bonder designed for high-precision soldering processes and mass production of high-power LEDs and power devices. The system delivers oxygen-free bonding and reduced thermal ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
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