Eutectic die bonder HP-EB1000FC

for die-attachflip-chipthermal

Overview
HP-EB1000FC is a fully automatic, high-precision eutectic placement system that supports both eutectic and silver-adhesive placement processes. It is designed for COC and COS eutectic workflows and features an automatic tool change system, making it suitable for R&D and industrial mass production.

Key features

• Fully automatic placement workflow
• High placement accuracy
• High flexibility with automatic tool change

Application areas

• Photonics
• Power devices
• Microwave RF devices
• New energy vehicle sector

Product advantages

• Dual heating welding stations with precise temperature control
• Flip module supporting 180° placement
• Compatibility with multiple feedstock formats (GEL-PAK, WAFFLE-PAK, wafer rings)
• Adaptive nozzle design to improve placement consistency and stability

Technical specifications

• Model: HP-EB1000FC
• Mounting method: front/back reference mount
• Placement processes: eutectic mounting (dipping, dispensing) and silver adhesive placement
• Target processes/packaging: COC; COS
• Use cases: R&D units and industrial mass production
• Placement accuracy: ±1 μm (standardized film); ±5 μm (application dependent)
• Equipment efficiency: 25–32 S/PCS (application dependent)
• Dual heating welding station: temperature range room temperature ~ 400 °C; heating rate ≤ 100 °C/s
• Flip module: 180° flip for placement
• Feedstock compatibility: 2" GEL-PAK, 2" WAFFLE-PAK, 6" wafer ring, 8" wafer ring
• Bonding accuracy: adaptive nozzle ±5 μm @3σ placement accuracy; ±0.1° @3σ placement rotation accuracy