Eutectic die bonder H3-EB10C

epoxymulti-chipautomated

The H3-EB10C is a fully automated eutectic surface-mount system for advanced packaging that supports eutectic soldering and silver-adhesive (epoxy) dispensing. It is engineered for production and R&D scenarios requiring multichip handling, automatic tool exchange and precision placement.

Highlights

• Throughput-optimized placement workflow
• Multichip capability with automatic pickup-tool exchange (up to 12 tools)
• Dual-field vision and multi-stage temperature control for precise alignment and soldering

Application area

• Photonics
• Power devices
• Microwave RF components
• New energy vehicle electronics

Technical features

• Eutectic soldering with scraping and multi-step temperature control
• Epoxy dispensing pump for silver-adhesive placement and multi-chip dispensing
• Automatic replacement of pickup tools; support for up to 12 distinct pickup tools with fixed movement and flexible switching
• Front/Back reference mount capability
• Mounting process: eutectic placement (dispensing, multi-chip)
• Dual-field-of-view vision/detection system for high-precision inspection
• Feedstock compatibility: 2″ GEL-PAK, 6″ wafer ring

Technical specifications

• Model: H3-EB10C
• Mounting method: Front/Back reference mount
• Mounting process: Eutectic placement (dispensing, multi-chip)
• Application scenarios: COC; COS (suitable for COC mass production and R&D testing)
• Mounting accuracy: ±3 μm (standard sheet); up to ±7 μm depending on application
• Bonding accuracy: ±5 μm @ 3σ placement accuracy; ±0.036° @ 3σ rotation accuracy
• Equipment efficiency: approx. 10–20 s/pcs (application-dependent)
• Multichip capability: up to 12 different pickup tools with automatic change
• Vision/detection: Dual-field view high-precision detection
• Feedstock compatibility: 2″ GEL-PAK, 6″ wafer ring