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Placement accuracy: 1 µm
... li>
Key Features
- High‑precision die
ASM Assembly Systems
Placement accuracy: 0.2 µm
... Product Overview
ASMPT AMICRA’s
die bonding solution for the photonic and microelectronic assembly market combines vision-driven placement with in-situ AuSn eutectic bonding. The NANO platform integrates four fixed high-resolution ...
ASM Assembly Systems
... Product overview
ASMPT AD838L-G2 Automatic
Die
Bonder for precision
die placement and bonding in semiconductor and advanced packaging production. The system supports flip chip handling and extra-
large ...
ASM Assembly Systems
Placement accuracy: 15 µm
... Overview
Automatic
die
bonder designed for
large-substrate handling and high throughput.
Features
- AD838L Series exclusive material handling capability with dragging-free
ASM Assembly Systems
Placement accuracy: 2 µm
... Overview
Flexible, precision multi-chip
die
bonder designed for
large-substrate handling and 12″ wafer input, intended for automated assembly of multi-chip packages with tight placement and ...
ASM Assembly Systems
Placement accuracy: 3 µm
... Product overview
Photon Pro is an automatic high-precision
die
bonder equipped with patented look-through pattern recognition technology for accurate
die placement. It supports
large ...
ASM Assembly Systems
Placement accuracy: 0 µm - 12.5 µm
... LQ-DA1201 is a high-speed, high-precision die bonder for IC packaging designed for solid-state mounting processes. The machine supports silver paste placement and the DAF process, accepts LF and substrate feed, and its ...
Placement accuracy: 3 µm - 3 µm
... >12-inch wafer ready: supports large wafers and continuous mixed-device runs while maximizing uptime.
Finetech
Placement accuracy: 3 µm
... Large- Area Multi-Chip Production Die Bonder The all new FineXT 6003 is a fully automatic large area production die bonder ...
Finetech
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