- Production Machines
- Machine for the electronics industry
- Die-attach die bonder
- ASM Assembly Systems
Die-attach die bonder AD838L-G2flip-chipautomatedMEMS
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Characteristics
- Technology
- flip-chip, for die-attach
- Operational mode
- automated
- Applications
- for the semiconductor industry, for sensors, MEMS
- Other characteristics
- high-accuracy, large-area
Description
Product overview
ASMPT AD838L-G2 Automatic Die Bonder for precision die placement and bonding in semiconductor and advanced packaging production. The system supports flip chip handling and extra-large substrates up to 300 mm x 100 mm. It integrates PR On The Fly (up-look PR) to improve placement accuracy and reduce bonding cycle time, and includes an automatic material handling system for factory automation integration.
Key features
Technical specifications
Applications
ASMPT AD838L-G2 Automatic Die Bonder for precision die placement and bonding in semiconductor and advanced packaging production. The system supports flip chip handling and extra-large substrates up to 300 mm x 100 mm. It integrates PR On The Fly (up-look PR) to improve placement accuracy and reduce bonding cycle time, and includes an automatic material handling system for factory automation integration.
Key features
- High-precision bonding performance with high throughput
- Flip chip handling capability
- AD838L Series exclusive material handling with dragging-free indexing
- Extra-large substrate handling up to 300 mm x 100 mm
- PR On The Fly capability (up-look PR) enhancing placement accuracy and reducing bonding cycle time
- Achieving factory automation
- Automatic material handling system
Technical specifications
- Product type: Automatic Die Bonder
- Model: AD838L-G2
- Manufacturer: ASMPT
- High-precision bonding with high throughput
- Flip chip handling capability
- Material handling: AD838L Series exclusive, dragging-free indexing
- Maximum substrate size: 300 mm x 100 mm
- PR On The Fly: up-look PR for improved placement accuracy and reduced bonding cycle time
- Automatic material handling system enabling factory automation
Applications
- Semiconductor die attach and packaging
- Flip chip assembly and bumping
- LED and optoelectronic packaging
- MEMS, sensors and precision electronic modules
- High-volume electronics manufacturing and automated production lines
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.