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{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
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{{/end}}
{{/each}}
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{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
Placement accuracy: 5 µm
... Panasonic's MD-P200 is a high-productivity die bonder. The synchronous head system offers unparalleled productivity, providing results that surpass conventional die bonders. The wafer ...
Panasonic Factory Automation Company
... method for the next generation. TDK is proud to introduce its new high-reliable, space-saving, low price equipment: AFM-15 Flip Chip Bonder (Ultrasonic Bonding Process). Low-energy bonding enables bonding ...
Placement accuracy: 0.5 µm - 0.8 µm
... High-Resolution Vision Systems Ensures precise alignment and inspection, crucial for maintaining high quality standards. Thin Die Capability Expertly handles thin dies, expanding your application possibilities. Superior Process ...
BE Semiconductor Industries N.V.
Placement accuracy: 5 µm - 5 µm
... for flexible production.
Key features
- High-speed and accurate solidification capability for flip-chip and IC mounting
- Supports multiple bonding processes: ultrasonic,
Placement accuracy: 1 µm - 5 µm
... /li>
Placement accuracy: 2 µm
... Automatic Multi-Purpose Bonder The automated FINEPLACER® femto pro embodies the essence of the successful FINEPLACER® femto die bonder platform, offering high precision and versatility with a focus ...
Finetech
... or ACF, NCP dispense. Highlights • Flip chip placement, reflow & curing in one step • Fluxfree reflow with laser • No additional reflow or curing • Suitable for Flip Chip Soldering ...
... Budget sensitive Manual Die Bonder The T-4909-AE is Tresky's 40-year anniversary model. On basis of the T-4909 we developed a new software running on an integrated Raspberry PC. Like all Tresky Die Bonder ...
Dr. Tresky AG
... for industrial usage in production environments. Typical Tasks • Pick and place • Die sorting • Dispensing of adhesives • UV curing • Chip to chip bonding • Chip to package assembly ProcessControlMaster Powerful ...
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