Die-attach die bonder LQ-FC200US

flip-chipthermalultrasonic

The LQ-FC200US is a hot-press ultrasonic flip-chip mounting system designed for high-throughput, high-precision solid-state mounting and multi-process bonding. It features an operator-friendly large color touch panel with dialog-style software and supports a variety of pickup and feeding methods for flexible production.

Key features

• High-speed and accurate solidification capability for flip-chip and IC mounting
• Supports multiple bonding processes: ultrasonic, thermo-compression, hot press, flux-dipped adhesive, dispensing/dipping (via fixture change)
• Operator-focused interface: large color touch panel with dialog-style software for simple, reliable operation
• Flexible pickup modes: forward loading, reverse loading and flip pickup
• Feeding compatibility: replaceable fixtures supporting 8-inch and 6-inch wafer ring feeding methods

Application Areas

• Photonics
• Power devices
• Microwave RF devices
• New energy vehicle (NEV) sector

Technical specifications

• Model: LQ-FC200US
• Mounting efficiency: 0.65 s/IC (highest-speed flip-chip ultrasonic mounting; includes engineering time 0.2 s)
• Mounting accuracy: ±5 μm @ 3σ (standard chip mounting)
• Rotational mounting accuracy: ±0.5° @ 3σ
• Force control range: 1 N ～ 50 N (programmable)
• Typical product examples: SAW devices, TCXO, LEDs, MEMS, power devices
• Constant-temperature heating: max 300°C; temperature fluctuation ±1°C
• Multiprocess support: ultrasonic bonding, hot press bonding, dispensing/dipping via manual fixture switching
• Flexible pickup modes: forward loading, reverse loading, flip pickup
• Feeding compatibility: interchangeable fixtures for 8-inch and 6-inch wafer ring feeding and other methods