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Placement accuracy: 3 µm - 3 µm
...
- 12-inch wafer ready: supports large wafers and continuous mixed-device runs while maximizing uptime.
- Automated wafer loading and delicate die management free operators
Placement accuracy: 3 µm
... Production Die Bonder The all new FineXT 6003 is a fully automatic large area production die bonder with true multi-chip, multi placement capability for high volume manufacturing. The ...
Placement accuracy: 0 µm - 12.5 µm
... high-precision die bonder for IC packaging designed for solid-state mounting processes. The machine supports silver paste placement and the DAF process, accepts LF and substrate feed, and its die feed ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 5 µm - 5 µm
... loading, reverse loading and flip pickup
Application Areas
- Photonics
- Power devices
- Microwave
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 7 µm - 10 µm
... supports mixed processing of multiple
wafer types and complex components, with modular hardware and configurable process parameters for tailored production.
Key features
- Single-head, triple-wafer-ring
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 3 µm - 7 µm
... electrically heated, thermostatically controlled, maximum heating temperature 250°C
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 3 µm - 7 µm
... >
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 1 µm - 5 µm
... 100 °C/s
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 0 µm - 12.5 µm
... HS-EB6000 is a fully automatic inline eutectic die bonder designed for high-precision soldering processes and mass production of high-power LEDs and power devices. The system delivers oxygen-free bonding and reduced thermal ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 1 µm - 3 µm
... dipping: glue-dipping mode with self-calibrating tip
Technical specifications
- Model: HP-EB3300
- Mounting
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 3 µm - 7 µm
... li>Dual-field-of-view vision/detection system for high-precision inspection
Technical specifications
- Model: H3-EB10C
- Mounting method:
Suzhou Lieqi Intelligent Equipment Co., Ltd.
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