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... next-generation 12” automatic die bonder designed for high-precision placement and stable dispensing. It integrates dedicated technologies for epoxy control, level sensing, motion control and fast vision inspection. The ...
ASM Assembly Systems
... Configurable platforms: AD8312Plus (high-speed) and AD8312FC (direct
die attach + flip chip)
Technical specifications
- Product type: Automatic die bonder
- Wafer
ASM Assembly Systems
... Designed for the power semiconductor market, the ASMPT SD8312 is a soft solder die bonder for power devices such as SOT223, TO-92, TO-220 and DPAK matrix. SD8312 supports 12" wafer handling and high-density ...
ASM Assembly Systems
... Overview
The ASMPT LITHOBOLT® G2 is a hybrid
bonder engineered for
Die‑to‑
Wafer (D2W) hybrid bonding in advanced semiconductor packaging. It is designed to support 3D and 2.5D integration workflows ...
ASM Assembly Systems
Placement accuracy: 1 µm
... TSV) processes
ASM Assembly Systems
Placement accuracy: 0.2 µm
... Product Overview
ASMPT AMICRA’s
die bonding solution for the photonic and microelectronic assembly market combines vision-driven placement with in-situ AuSn eutectic bonding. The NANO platform integrates four fixed high-resolution ...
ASM Assembly Systems
Placement accuracy: 0 µm - 1.5 µm
... Overview
ASMPT AMICRA CoS is a purpose-built multi-
die
bonder for Chip-on-Submount applications. It performs high-precision multi-
die placement on singulated submounts using eutectic bonding ...
ASM Assembly Systems
... Automatic die bonder
ASM Assembly Systems
Placement accuracy: 0 µm - 80 µm
... AD832U is an automatic eutectic die bonder delivering precise placement for a wide range of horizontal small discrete packages (examples: SOD323, SOD923, SOT113). With a 300 x 100 mm handling area and support for ...
ASM Assembly Systems
Placement accuracy: 15 µm
...
Notes
*All performance is package and material dependent
Technical specifications
- Model: AD838L-Plus
- Product type: Automatic Die
ASM Assembly Systems
Placement accuracy: 0 µm - 12.5 µm
... high-precision die bonder for IC packaging designed for solid-state mounting processes. The machine supports silver paste placement and the DAF process, accepts LF and substrate feed, and its die feed ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 5 µm - 5 µm
... loading, reverse loading and flip pickup
Application Areas
- Photonics
- Power devices
- Microwave
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 7 µm - 10 µm
... supports mixed processing of multiple
wafer types and complex components, with modular hardware and configurable process parameters for tailored production.
Key features
- Single-head, triple-wafer-ring
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 3 µm - 7 µm
... electrically heated, thermostatically controlled, maximum heating temperature 250°C
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 3 µm - 7 µm
... >
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 1 µm - 5 µm
... 100 °C/s
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 0 µm - 12.5 µm
... HS-EB6000 is a fully automatic inline eutectic die bonder designed for high-precision soldering processes and mass production of high-power LEDs and power devices. The system delivers oxygen-free bonding and reduced thermal ...
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 1 µm - 3 µm
... dipping: glue-dipping mode with self-calibrating tip
Technical specifications
- Model: HP-EB3300
- Mounting
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 3 µm - 7 µm
... li>Dual-field-of-view vision/detection system for high-precision inspection
Technical specifications
- Model: H3-EB10C
- Mounting method:
Suzhou Lieqi Intelligent Equipment Co., Ltd.
Placement accuracy: 3 µm - 3 µm
...
- 12-inch wafer ready: supports large wafers and continuous mixed-device runs while maximizing uptime.
- Automated wafer loading and delicate die management free operators
Finetech
Placement accuracy: 3 µm
... Production Die Bonder The all new FineXT 6003 is a fully automatic large area production die bonder with true multi-chip, multi placement capability for high volume manufacturing. The ...
Finetech
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