- Production Machines
- Machine for the electronics industry
- Eutectic die bonder
- ASM Assembly Systems
Eutectic die bonder SD8312for die-attachfor the semiconductor industryfor wafers
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Characteristics
- Technology
- for die-attach, eutectic
- Applications
- for the semiconductor industry, for wafers
Description
Product overview
Designed for the power semiconductor market, the ASMPT SD8312 is a soft solder die bonder for power devices such as SOT223, TO-92, TO-220 and DPAK matrix. SD8312 supports 12" wafer handling and high-density lead-frame handling to meet current and next-generation production requirements.
Features
Technical specifications
Designed for the power semiconductor market, the ASMPT SD8312 is a soft solder die bonder for power devices such as SOT223, TO-92, TO-220 and DPAK matrix. SD8312 supports 12" wafer handling and high-density lead-frame handling to meet current and next-generation production requirements.
Features
- Support for 12" soft solder die bonding process
- High-density lead-frame handling with a universal workholder design
- High-speed performance combining proven and innovative technologies
- Controlled oxygen level management for process stability
- Capable of AB dice handling
Technical specifications
- Model: SD8312
- Brand: ASMPT
- Application: Power semiconductor market
- Supported device types: SOT223, TO-92, TO-220, DPAK matrix
- Wafer handling: 12"
- Lead frame handling: High-density capability with universal workholder design
- Performance: High-speed operation combining proven and innovative technologies
- Environment control: Oxygen level control
- Dice handling: AB dice handling capable
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IC & Discrete
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