Wire bonders

AS-WBA60 Aluminum Wire Bonder is a highly stable,precise and efficient equipment which can serve as a fast and efficient bonding solution for power transistors (including the automotive ...

The Palomar 9000 Wedge Bonder is a high-speed fine wire wedge and ribbon bonder with optional interchangeable clamps for 45-60° and 90° deep access bonding on a single ...

... management for modern wire bonding, from part design and development to process validation and intuitive operations control. i2Gi is implemented on the 8000i Wire Bonder and available ...

... fine wire bonder capable of ball bumping and customized looping profiles. Based on Palomar’s proven wire bonder design and incorporating the latest productivity technology ...

RAPID™ Pro introduces advanced process capabilities, real-time monitoring and diagnostics to ensure the best quality and efficient assembly serving high-performance and high-reliability semiconductor applications. Key Features: Real-time ...

RAPID™ MEM introduces advanced process capabilities, real-time monitoring and diagnostics to ensure the best quality and efficient assembly serving high-performance and high-reliability semiconductor applications. Key Features: Real-time ...

RAPID™ introduces advanced process capabilities, real-time monitoring and diagnostics to ensure the best quality and efficient assembly serving high-performance and high-reliability semiconductor applications. Key Features: Real-time ...

IConn ProCu PLUS is the new state-of-the-art in copper wire bonding. With its upgraded and enhanced subsystems, it is engineered to deliver all the capability you will need – For Copper today, PLUS tomorrow. The IConn ...

IConn MEM PLUS is the new high performance Memory device bonder for gold and silver alloy wire bonding. With its advanced process, looping, overhang control and ease of use capabilities, it delivers high ...

... in fully automatic wire bonding. With its upgraded and enhanced subsystems, it is engineered to deliver all the capability you will need – For Wire Bonding today, PLUS tomorrow. The IConn PLUS is designed ...

ConnX ELITE™ is the latest high speed automatic wire bonder in the industry leading Power Series. Updated motion control systems and the Quick Suite processes deliver maximum productivity and simplified ...

OptoLux™ high speed wire bonder is the latest generation ball bonder that sets the new standards and benchmark in the LED market. Key Features: High speed X-Y-Z motion control system New ...

ConnX ELITE™ Opto is the latest high speed automatic wire bonder in the industry leading Power Series. Updated motion control systems and the Quick-LED Suite processes deliver maximum productivity and ...

The Asterion™ wedge bonder is built on an enhanced architecture that includes an expanded bond area, new robust pattern recognition capabilities and extremely tight process controls. Together, these deliver ...

... Bond Access - Ample work- space due to Special Bond Head Design We install extra-long bond arms/transducer in all our bonders. Further is the clamp and its screw installed on top of the tool instead of behind it. ...

With automatic Z- Axis Our Bonder can be configurated individually and meet almost any task and can fit into almost any budget. Touch Screen Easy Handling and Control with the 6,5" TFT Our long tested 6,5“control ...

... Bond Access - Ample work- space due to Special Bond Head Design We install extra-long bond arms/transducer in all our bonders. Further is the clamp and its screw installed on top of the tool instead of behind it. ...

Automatic Wire Bonder With motorized Z-Y-X Axes and Bond Head Rotation The motorized Z-Y-X Axes and the rotatable Bond Head are the key to configure, safe and execute automatic Bond processes. Option Pattern Recognition Teaser Bonding ...

Heavy Wire Bonder With motorized Z- & Y- Axes Our goal is to support developers in realizing new ideas and applications for microelectronics. We developed the HB30 for applications with higher energy ...