Wedge bonder wire bonder B307A

B307A Hybrid Wedge Bonder is a multifunction, highly stable wedge bonder that provides efficient and high-yield bonding for automotive-grade and industrial modules. Al Wire 4~20mil Al Ribbon 20*4mil~80*10mil The Hybrid Wedge Bonder is primarily used for IGBU modules, and extends to applications such as laser modules and charging pile modules. The equipment can meet the process requirements for Al wire, Al power ribbon, Cu wire, and Cu power ribbon. The bondhead can be quickly switched within 60 minutes, ensuring high stability for the customer. Strong Compatibility Suitable for Al wire and Al ribbon processes Multiple Application Scenarios Ideal for IGBT, laser module, on-board charger module, and other scenarios Process Support Extensive experience in process applications guarantees the enduring success and reliability of your products High-end Intelligence BPM, GBS, ALC, and other functions facilitate easy operation