{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
X travel: 300 mm
Y travel: 400 mm
Repeatability: 1 µm
... is used for laser modification and cutting of silicon-based wafers in the semiconductor industry for 8-inch and above chip sealing and testing plants. •High quality There is no damage on the surface, no cutting ...
Farley Laserlab
X travel: 200 mm
Y travel: 300 mm
Repeatability: 2 µm
... picosecond laser is used for precision half cutting or full cutting of silicon and compound semiconductor wafers. • High quality Cutting line width is narrow (taking ultraviolet collimation ...
Farley Laserlab
X travel: 200 mm
Y travel: 300 mm
Repeatability: 2 µm
... picosecond laser is used for precision half cutting or full cutting of silicon and compound semiconductor wafers. • High quality Cutting line width is narrow (taking ultraviolet collimation ...
Farley Laserlab
X travel: 600 mm
Y travel: 600 mm
Cutting speed: 84 m/s
... Circular Diamond
Wire
Cutting
Machine
Model: SVS60-60 – Faster Than Band Saw, Beyond
EDM Limitations
The
SVS60-60 Diamond Wire Cutting ...
Vimfun Diamond Wire Saw
X travel: 1,350 mm
Y travel: 850 mm
Cutting speed: 0 m/s - 84 m/s
... industrial wire cutting machine perfect to cut complex profile. The SVI135-85 is an advanced endless diamond wire cutting machine. It utilizes an endless diamond wire ...
Vimfun Diamond Wire Saw
Y travel: 200 mm
Z travel: 200 mm
Maximum cutting height: 200 mm
... single-wire internal profile cutting machine uses a reeled (spooled) diamond wire and can cut both external and internal contours of brittle, non-conductive workpieces. It is designed for high-precision ...
Vimfun Diamond Wire Saw
multi-wire cutting machineGC-MJ706R/908R
... Photovoltaic Cutting Equipment General description: Launched in 2022, this product is designed for silicon rod cutting, with the featuring advantages of high yield, small slope, less edge chipping, ...
Qingdao Gaoce Technology Co., Ltd.
X travel: 270 mm
Y travel: 420 mm
Maximum cutting height: 200 mm
... materials: jade, quartz, ceramics, crystals, sapphire, silicon wafers, silicon carbide, magnetic materials, rare metals
laser cutting machineMLC7200C4-A
Laser power: 500 W
Overall length: 3,300, 2,600 mm
Maximum width: 3,250, 3,600 mm
... the production of high-efficiency photovoltaic modules replaces the conventional laser dicing machine The core principle of non-destructive laser cutting is laser thermal stress controlled fracture technology, which ...
Maximum cutting height: 305 mm
Tube diameter: 305 mm
Cutting speed: 20, 35 m/s
... specifically designed for slicing monocrystalline silicon blocks with up to 300mm diameter into high quality wafers for the semiconductor industry. The new developed DW292-300 is capable to be run with slurry as well ...
the best suppliers