Monocrystalline silicon cutting machines

... equipment is used for laser modification and cutting of silicon-based wafers in the semiconductor industry for 8-inch and above chip sealing and testing plants. •High quality There is no damage on the ...

... picosecond laser is used for precision half cutting or full cutting of silicon and compound semiconductor wafers. • High quality Cutting line width is narrow (taking ...

Overall length: 800 mm
Overall width: 1,150 mm
Height: 1,700 mm

... picosecond laser is used for precision half cutting or full cutting of silicon and compound semiconductor wafers. • High quality Cutting line width is narrow (taking ...

X travel: 235 mm
Y travel: 145 mm

... equipment is mainly developed for semiconductor and 3C industries. Suitable for cutting silicon, ceramics, glass, SiC and other materials. It has the advantages of fast cutting ...

Tube diameter: 200 mm - 300 mm
Cutting speed: 0 m/s - 30 m/s
Overall length: 5,200 mm

This equipment is used for machining Mono-silicon bars. Cropping and sampling the hard and brittle materials through electroplated diamond wire with feeding process. It is a reliable, high-efficient and ...

Tube diameter: 200 mm - 300 mm
Cutting speed: 0 m/s - 30 m/s
Overall length: 5,270 mm

... Single Mono-crystal Rod Squaring Machine is a machine for squaring silicon ingots by using diamond wires. It uses one diamond wire reciprocating at high speed to grind silicon ...

Tube diameter: 150 mm - 270 mm
Cutting speed: 0 m/s - 25 m/s
Overall length: 5,270 mm

... Mono807 Diamond Wire mono-silicon cutting machine is a machine using a diamond wire to cut and process mono-silicon ingots.It employs a processing technique ...

Cutting speed: 0 m/s - 25 m/s
Overall length: 3,400 mm
Overall width: 2,300 mm

... Multi-silicon Cutting Machine is a machine using a diamond wire to cut and process muiti-silicon brick. It employs a processing technique in which silicon ...

Maximum cutting height: 305 mm
Tube diameter: 305 mm
Cutting speed: 20, 35 m/s

The DW292-300 is specifically designed for slicing monocrystalline silicon blocks with up to 300mm diameter into high quality wafers for the semiconductor industry. The new developed DW292-300 is capable ...