Diamond wire cutting machine SGO 20

for monocrystalline siliconfor glassfor ceramics

Product Overview This single-wire internal profile cutting machine uses a reeled (spooled) diamond wire and can cut both external and internal contours of brittle, non-conductive workpieces. It is designed for high-precision internal profile cutting in applications such as semiconductors, ceramics, optics and gemstone processing. Key Features Fully enclosed design for safe operation. High-precision cutting suitable for military, aerospace and high-tech manufacturing. Horizontal double-drive structure with compact footprint. Box-type cast-iron bed and worktable for enhanced rigidity. Precision linear guideways and ball screws for accurate motion control. Uses electroplated (reeled) diamond wire — no slurry required for high-speed cutting. CNC control with Siemens PLC and touch-screen interface; programmable with specialized wire-cutting software. Pneumatic tension control with wire break detection and automatic stop. Technical Specification of This Internal Profile Cutting Equipment 1 - Maximum Workpiece Length (mm) - 200 2 - Maximum Workpiece Width (mm) - 200 3 - Maximum Workpiece Height (mm) - 200 4 - Worktable Y-Axis Travel (mm) - 200 5 - Worktable Z-Axis Travel (mm) - 200 6 - Maximum Diamond Wire Speed (m/s) - 10 7 - Minimum Feed Increment Y-Axis (mm) - 0.01 8 - Minimum Feed Increment Z-Axis (mm) - 0.01 9 - Repeat Positioning Accuracy Y-Axis (mm) - 0.03 10 - Repeat Positioning Accuracy Z-Axis (mm) - 0.03 11 - Total Power Consumption (kW) - 2 12 - Power Supply - 220V 50Hz 13 - Machine Size (mm) - 1300×1100×1900 14 - Machine Weight (kg) - 1100 Additional Features & Mechanical Details Wire feed and take-up system to maintain tension; some components support feed speeds up to ~11 m/s. Protective enclosures to prevent debris contamination. User-performable wire replacement; supports long spooled wire (up to ~200 m capacity). Design minimizes cracking/chipping in brittle materials and delivers high surface smoothness compared with conventional processes. Cutting Capability & Materials Optimized for brittle, non-conductive materials: silicon, sapphire, technical ceramics, graphite and optical glass. Suitable for brittle crystals, refractory and composite materials, and large gemstones. Capable of sectioning/slicing and both external and internal cutting, including threading the wire through internal holes for internal profiles. Control & Operation CNC control system with Siemens PLC and touch-screen interface for intuitive operation. Programmable with specialized wire-cutting software to run automated cutting programs. Pneumatic tension control ensures stable wire tension and repeatable cuts. Functions Sectioning and slicing: produce slices or section workpieces (thickness range 0.3 mm to 200 mm). External cutting: precise shaping of outer geometries. Internal cutting: thread the wire through internal holes to cut complex internal shapes. Applications Optoelectronics: shaping synthetic sapphire and crystals for LEDs, lasers and optics. Ceramic industry: cutting industrial ceramics (cordierite, titanate ceramics, mullite, sialon, steatite, Macor, etc.). Scientific research: precision cutting of crystals (e.g., quartz) for research and optical components. Jewelry and luxury goods: processing large gemstones and sapphire glass for displays and watch components. Specialized materials processing: cutting meteorite samples and other specialty materials. Advantages High-precision cutting with reduced material cracking due to horizontal double-drive structure and diamond wire. Large wire storage capacity for long spooled wire (up to ~200 m) enabling extended runs. Stable rigidity from cast-iron structure for consistent accuracy. Enclosed safety design with automatic stop on wire break. Notes The machine is intended for laboratory and industrial-scale applications that require high surface quality and precision. Referenced parameters: noise ≤ 80 dB; slice thickness range 0.3–200 mm. Technical Specifications Model: SGO 20 Max workpiece size: 200 mm × 200 mm × 200 mm Worktable travel (Y / Z): 200 mm / 200 mm Minimum feed increment (Y / Z): 0.01 mm / 0.01 mm Repeat positioning accuracy (Y / Z): 0.03 mm / 0.03 mm Maximum diamond wire speed: 10 m/s Total power consumption: 2 kW Power supply: 220V 50Hz Machine dimensions: 1300 × 1100 × 1900 mm Machine weight: ~1100 kg Wire type: electroplated (reeled) diamond wire; supports long spooled wire (up to ~200 m) Cutting thickness capability: 0.3 mm – 200 mm Typical applications: silicon, sapphire, ceramics, graphite, optical glass, gemstones Safety: fully enclosed, wire break detection and automatic stop Control: CNC with Siemens PLC and touch-screen interface