Diamond wire cutting machine SH100-R
for glassblockswafer

Diamond wire cutting machine - SH100-R - Vimfun Diamond Wire Saw - for glass / blocks / wafer
Diamond wire cutting machine - SH100-R - Vimfun Diamond Wire Saw - for glass / blocks / wafer
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Characteristics

Technology
diamond wire
Material
for glass
Product handled
blocks, wafer
Control type
CNC
Applications
for the semiconductor industry
Other characteristics
high-speed, with exchange table, horizontal
Y travel

Max.: 1,100 mm
(43.31 in)

Min.: 550 mm
(21.65 in)

Z travel

500 mm
(20 in)

Cutting speed

Max.: 38 m/s
(124.672 ft/s)

Min.: 0 m/s
(0 ft/s)

Laser power

6,500 W

Maximum width

Max.: 1,000 mm
(39 in)

Min.: 100 mm
(4 in)

Weight

2,000 kg
(4,409.25 lb)

Power supply

220 V

Description

This diamond wire saw for glass is a good device to cut big size Fused Glass Quartz Ingots or other crystals for Custom Semiconductor Application. The Diamond Wire Saw For Glass is a horizontal cutting solution engineered for precision slicing of large crystal materials. With a cutting capacity of up to 1000mm in diameter and custom options available for greater sizes, this machine delivers fast, high-quality cuts surpassing traditional slicers. Its design ensures superior surface finish, meeting the exacting demands of crystal processing with efficiency and precision. Model SH100-R has an endless diamond wire cutting tool that can move in a single direction without the need for reversing. The closed diamond wire enables high linear speeds, reaching even up to 38 m/s. As a result, it allows for fast cutting speeds and maintaining superior cutting surface quality.The loading table can be customized with 3 or 2 smaller tables .

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.