Diamond wire cutting machine SG20

for glassfor ceramicswafer

Product overview
The SG20 is an endless (closed-loop) diamond wire saw with a gantry structure, engineered for precision slicing of small optical glass, crystals and technical ceramics. It supports controlled multi-slice jobs, real-time thickness setting and enclosed operation for low-contamination R&D and small-batch production environments.

Key features

• Precision slicing for small workpieces up to 200 × 200 × 220 mm using diamond wire Ø0.3–1.0 mm.
• Dual slicing modes: equal-thickness mode and variable (custom) thickness mode with up to 10 layers per job.
• Fully enclosed gantry design with safety doors to limit contamination and splash.
• Intelligent control with touchscreen + buttons: kerf compensation, peeling/non-peeling modes, real-time slice thickness, wire-break detection, production tracking and auto shutdown.
• Automatic lubrication and water-cooling circulation to maintain clean cutting conditions and reduce wear; optional oil-mist collection support.

Technical specifications

• Model: SG20
• Machine type: Endless diamond wire saw, gantry structure
• Max workpiece envelope: 200 × 200 × 220 mm
• Worktable travel (Y × Z): 200 mm × 220 mm
• Diamond wire diameter: Ø0.3–1.0 mm
• Max diamond wire speed: 58 m/s
• Minimum feed increment (Y, Z): 0.01 mm
• Repeat positioning accuracy (Y, Z): 0.01 mm
• Total power consumption: 1.5 kW; Power supply: 220V 50Hz
• Machine size: 1044 × 943 × 1810 mm; Weight: 400 kg
• Control: PLC + servo, 10" touchscreen, programmable slicing logic
• Cooling & lubrication: water circulation and automatic lubrication; optional oil-mist recovery

Typical applications

• Optical glass: filters, wavelength windows, laser optics blanks and protective substrates.
• Ceramics: alumina, AlN and sintered ceramics for electronics and thermal components.
• Crystal materials: quartz, YAG and other photonic blanks for polishing or dicing.
• Research sample prep: controlled-thickness specimens, multi-slice and kerf-compensated slicing for labs and R&D.

Cutting performance & advantages

• Fine, programmable slice-thickness control down to ultra-thin slices (example capability to ~0.1 mm) and multi-layer jobs.
• Superior surface quality on brittle materials with reduced chipping compared with band saws.
• Automatic constant-tension and dynamic tension control to reduce wire breaks and extend wire life.
• Rigid cast frame and precision guides/ball screws delivering ±0.01 mm positioning accuracy for repeatable results.
• Modular design with auto-lubrication reduces maintenance time and extends component life.