Diamond wire cutting machine SG30

abrasive wirediamondfor precious metals

The Optical Glass Cutting Machine SG30 stands at the forefront of cutting technology, specifically engineered for the optoelectronics industry.
This cutting-edge model employs an endless diamond wire as its cutting tool, ensuring swift cutting speeds and impeccably smooth finishes. Unhindered by the constraints of traditional cutting tools, it boasts versatility in cutting dimensions. With a production capacity approximately 3 to 5 times greater than that of conventional inner-Diameter saw.
This machine can cut material size smaller than 300*300*300mm.
Its a perfect slicer, the program can set same slice thickness and different slice thickness in one program.


Cutting Functions and Applications

Ceramic Materials:

Alumina ceramics, zinc oxide ceramics, zirconia ceramics, sputtering target ceramics, honeycomb ceramics, semiconductor ceramics, conductive ceramics, non-conductive ceramics, and others.

Crystal Materials:

Graphite, silicon crystals (solar-grade multicrystalline silicon and monocrystalline silicon), sapphire, alumina crystals, infrared optical glass crystals, silicon carbide crystals, cesium iodide crystals, etc.

Glass Materials:

Chalcogenide glass, optical glass, quartz glass, infrared glass, glass tubes, and related glass components.

Metal Materials:

Iron, aluminum, copper, titanium alloys, magnesium alloys, various metals and alloys, and nonferrous materials such as zinc sulfide and ferrites.

Composite Materials:

PVC plates, carbon-fiber composites, glass-fiber composites, and similar engineered composites.

Rock and Geological Materials:

Natural rocks, jade, meteorites, emerald, agate, and other valuable materials requiring precision cutting; geological thin sections and wafers for sedimentary rocks, igneous rocks, metamorphic rocks, and ore specimens.

Thermoelectric Materials:

Bismuth telluride, lead telluride, silicon–germanium alloys, and similar thermoelectric compounds.

Infrared Optical Materials:

Zinc selenide, zinc sulfide, silicon, germanium, and other infrared crystals.

Biomedical Materials:

Slicing of plastinated biological specimens (human and animal organs); combined soft–hard tissue slices of maxillofacial structures, dental implants, tooth crowns and bridges, and histological samples; orthopedic tissue slices (femur, hip joint, vertebrae, fresh soft/hard tissues, bone specimens containing implants); cardiovascular stent sectioning; kidney stone and other medical specimen slicing.

Note:
Any material whose hardness is lower than that of the diamond wire can be processed with precision cutting.