Diamond wire cutting machine SH60-R

for monocrystalline siliconfor glassfor ceramics

Product overview
The SH60-R is an endless (closed‑loop) diamond wire saw for horizontal slicing of quartz, optical glass, silicon and other hard, brittle materials. It combines a servo‑driven YZ dual‑axis motion system with a continuously rotating worktable to deliver uniform contact and consistent, low‑damage slices suitable for optical and semiconductor applications.

Key features

• Endless diamond wire cutting — Electroplated diamond wire loop for continuous high‑speed slicing of quartz, optical glass, silicon and technical ceramics.
• Fully programmable YZ motion — Set slice thickness, feed and cutting speed; servo control with ±0.01 mm feed precision and repeatability.
• Rotary worktable Ø600 mm — 360° continuous rotation ensures uniform wire‑to‑workpiece contact for large and irregular pieces.
• Touchscreen PLC & hand controller — Industrial HMI for process setup, monitoring and manual override.
• Integrated water cooling & recirculation — Closed coolant tank and filtration maintain low cutting temperature and clean surfaces.
• Automatic lubrication — Centralized lubrication for moving components to reduce maintenance needs.
• Oil mist collection — Enclosed cutting chamber with oil‑mist recovery for a cleaner shop environment.

Applications

• Large quartz block slicing for optical substrates, IR windows and photonic components.
• Processing of engineering ceramics (Al2O3, AlN, Si3N4) for electronics and optics.
• Optical glass plate cutting (filters, laser windows).
• Pre‑processing of semiconductor materials (silicon ingots, brittle substrates).

How it works
The SH60-R uses a horizontal endless diamond wire loop with constant‑tension control, servo‑driven YZ axes and a continuously rotating table to maintain even wire contact across the workpiece. Combined cooling, filtration and lubrication systems enable long, high‑speed runs while protecting surface quality and machine components.

Comparison with other cutting methods

• Endless diamond wire saw — Low material loss (kerf ~0.6–0.9 mm), very large workpieces, high surface quality and high precision.
• Multi‑wire saw — Thinner kerf (0.1–0.3 mm) for wafers, higher throughput for many thin slices but limited maximum workpiece diameter.
• Diamond band saw — Larger kerf (>1.0 mm), suited to rough cutting and pre‑segmentation of very large pieces.
• Waterjet cutting — Good for shape cutting and thick sections, but larger kerf and lower surface finish for optical materials.
• Laser cutting — High speed for compatible materials; not optimal for quartz due to low IR absorption and thermal effects.
• Inner diameter (ID) saw — Used for small rods/discs and thin wafers; limited to smaller diameters.

Technical specifications

• Worktable diameter: Ø600 mm
• Maximum workpiece height: 500 mm
• Y‑axis travel: 315 mm
• Z‑axis travel: 500 mm
• Diamond wire length: ~3500 mm
• Wire diameter range: 0.35–1.0 mm
• Maximum wire speed: 84 m/s
• Minimum feed increment (Y/Z): 0.01 mm
• Repeatability (Y/Z): ±0.01 mm
• Cutting speed range: 0–1000 mm/min (adjustable)
• Guide wheel sizes: Ø250 mm / Ø180 mm
• Motor power: 0.75 kW (max 2800 RPM)
• Power supply: 220 V, 50 Hz, 3‑phase
• Machine dimensions (L×W×H): 1646 × 1733 × 2010 mm
• Net weight: ~1300 kg
• Irregular shape cutting: Not supported