Wafer dicing saw LFD7100

LAD7100 is a fully automatic 12" twin spindle dicing saw that supports various processes such as full cut and half cut, offers greater dicing efficiency and automatic wafer cleaning, and meets the throughput and quality requirements of customer. Y axis positioning accuracy 0.002MM/310mm Workpiece size up to 12" Fully automatic and highly efficient dicing Highly efficient wafer dicing, excellent hardware quality and continuously upgraded software system, enabling customer to dice wafers efficiently. For customers in the semiconductor, optical module, and LED industries that require precise dicing process, we provide 8" dicing saw, wafer cleaning machine, associated consumables, and comprehensive dicing process solutions. LFD7100 is a fully automatic 12" twin spindle dicing saw designed for dicing workpieces up to 12". Featuring two high-power facing spindles, special microscopes on both Z1 and Z2 axes, and NCS and BBD for standard version, coupled with automation from loading, alignment, dicing, cleaning to unloading, it can significantly reduce the time required for alignment, inspection, and loading/unloading, thereby lowering labor costs and improving production efficiency. Highly efficient Twin spindles work together to dice 12" wafers automatically and efficiently, leading to shorter cycle times. Fully automatic Automatic wafer loading and unloading, automatic wafer cleaning, less workers required. Highly adaptable NCS (Non-contact Setup) and BBD (Blade Breakage Detection) are standard features. Easy to use User-friendly operation interface, upgrade of software as requested by customer, easy for customer to import.